Seiko Epson Corporation, Japanese Company famous all over the globe for its electronic products and accessories recently announced that it has developed a new type of bump for mounting chips to drive next-generation LCD panels and new Chip on Glass (COG) mounting technology.
The Company will commence mass production of latest models based on the newly devised technology w.e.f. this fiscal year. The details on the new technology are to be announced at the 17th Microelectronics Symposium (MES 2007) hosted by the Japan Institute of Electronics Packaging and at the 40th International Symposium on Microelectronics hosted by the International Microelectronics and Packaging Society (IMAPS 2007).
Conventional gold bumps and COG mounting solutions has already reached its limits in terms of the connective performance needed for next-generation LCD panels, which demand high definition and high quality. Looking this Epson developed World’s first COG mounting using resin core bumps ideal for next-generation LCD panels demanding high definition and high quality. The latest technology aims at delivering smaller geometry for bump pitch, greatly enhanced reliability of connection, eliminating need for new investment or for gold plating.